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MC10H186 Hex D Master-Slave Flip-Flop with Reset
Description
The MC10H186 is a hex D type flip-flop with common reset and clock lines. This MECL 10HTM part is a functional/pinout duplication of the standard MECL 10KTM family part, with 100% improvement in clock toggle frequency and propagation delay and no increase in power-supply current.
Features
http://onsemi.com MARKING DIAGRAMS*
16 MC10H186L AWLYYWW CDIP-16 L SUFFIX CASE 620A 1
* Propagation Delay, 1.7 ns Typical * Power Dissipation, 460 mW Typical * Improved Noise Margin 150 mV (Over Operating Voltage and * * *
Temperature Range) Voltage Compensated MECL 10K Compatible Pb-Free Packages are Available*
CLOCKED TRUTH TABLE
R L L L H C L H* H* L D X L H X Qn+1 Qn L H L 16 1 PDIP-16 P SUFFIX CASE 648 1 16 MC10H186P AWLYYWWG
* A clock H is a clock transition from a low to a high state.
DIP PIN ASSIGNMENT
RESET Q0 Q1 Q2 D0 D1 D2 VEE 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 VCC Q5 Q4 Q3 D5 D4 D3 CLOCK 20 1 PLLC-20 FN SUFFIX CASE 775 A WL, L YY, Y WW, W G
1 20
10H186G AWLYYWW
= Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Package
Pin assignment is for Dual-in-Line Package. For PLCC pin assignment, see the Pin Conversion Tables on page 18 of the ON Semiconductor MECL Data Book (DL122/D).
*For additional marking information, refer to Application Note AND8002/D.
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 1
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet.
(c) Semiconductor Components Industries, LLC, 2006
February, 2006 - Rev. 7
Publication Order Number: MC10H186/D
MC10H186
Table 1. MAXIMUM RATINGS
Symbol VEE VI Iout TA Tstg Power Supply (VCC = 0) Input Voltage (VCC = 0) Output Current - Continuous - Surge Characteristic Rating -8.0 to 0 0 to VEE 50 100 0 to +75 -55 to +150 -55 to +165 Unit Vdc Vdc mA C C C
Operating Temperature Range Storage Temperature Range - Plastic - Ceramic
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.
Table 2. ELECTRICAL CHARACTERISTICS (VEE = -5.2 V 5%) (See Note 1.)
0 Symbol IE IinH Characteristic Power Supply Current Input Current High Pins 5,6,7,10,11,12 Pin 9 Pin 1 Input Current Low High Output Voltage Low Output Voltage High Input Voltage Low Input Voltage Min - - - - 0.5 -1.02 -1.95 -1.17 -1.95 Max 121 430 670 1250 - -0.84 -1.63 -0.84 -1.48 Min - - - - 0.5 -0.98 -1.95 -1.13 -1.95 25 Max 110 265 420 765 - -0.81 -1.63 -0.81 -1.48 Min - - - - 0.3 -0.92 -1.95 -1.07 -1.95 75 Max 121 265 420 765 - -0.735 -1.60 -0.735 -1.45 mA Vdc Vdc Vdc Vdc Unit mA mA
IinL VOH VOL VIH VIL
1. Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is maintained. Outputs are terminated through a 50 W resistor to -2.0 V.
Table 3. AC PARAMETERS
0 Symbol tpd tset thold tr tf ftog trr Characteristic Propagation Delay Set-up Time Hold Time Rise Time Fall Time Toggle Frequency Reset Recovery Time (t1-9+) Min 0.7 1.5 1.0 0.7 0.7 250 3.0 Max 3.0 - - 2.6 2.6 - - Min 0.7 1.5 1.0 0.7 0.7 250 3.0 25 Max 3.0 - - 2.6 2.6 - - Min 0.7 1.5 1.0 0.7 0.7 250 3.0 75 Max 3.0 - - 2.6 2.6 - - Unit ns ns ns ns ns MHz ns
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously.
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MC10H186
APPLICATION INFORMATION The MC10H186 contains six high-speed, master slave type "D" flip-flops. Data is entered into the master when the clock is low. Master-to-slave data transfer takes place on the positive-going Clock transition. Thus outputs may change only on a positive-going Clock transition. A change in the information present at the data (D) input will not affect the output information any other time due to the master-slave construction of this device. A common Reset is included in this circuit. THE RESET ONLY FUNCTIONS WHEN THE CLOCK IS LOW.
LOGIC DIAGRAM
D0 5 2 Q0
D1
6
3
Q1
D2
7
4
Q2
D3
10
13
Q3
VCC = PIN 16 VEE = PIN 8
D4
11
14
Q4
D5 CLOCK RESET 9 1
12
15
Q5
ORDERING INFORMATION
Device MC10H186FN MC10H186FNG MC10H186FNR2 MC10H186FNR2G MC10H186L MC10H186P MC10H186PG Package PLLC-20 PLLC-20 (Pb-Free) PLLC-20 PLLC-20 (Pb-Free) CDIP-16 PDIP-16 PDIP-16 (Pb-Free) Shipping 46 Units / Rail 46 Units / Rail 500 / Tape & Reel 500 / Tape & Reel 25 Unit / Rail 25 Unit / Rail 25 Unit / Rail
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
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MC10H186
PACKAGE DIMENSIONS
20 LEAD PLLC CASE 775-02 ISSUE E
B -N- Y BRK D -L- -M- W D V 0.010 (0.250) T L-M N Z 0.007 (0.180) M T L-M U
S
N
S S
0.007 (0.180) M T L-M
N
S
20
1
X VIEW D-D
G1
S
S
S
A Z R
0.007 (0.180) M T L-M 0.007 (0.180) M T L-M
S
N N
S
S
S
H K1
0.007 (0.180) M T L-M
S
N
S
C
E G G1 0.010 (0.250) S T L-M 0.004 (0.100) J -T- VIEW S
S SEATING PLANE
K F VIEW S 0.007 (0.180) M T L-M
S
N
S
N
S
NOTES: 1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M, 1982. 2. DIMENSIONS IN INCHES. 3. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
DIM A B C E F G H J K R U V W X Y Z G1 K1
INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 --- 0.025 --- 0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 --- 0.020 2_ 10 _ 0.310 0.330 0.040 ---
MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 --- 0.64 --- 8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 --- 0.50 2_ 10 _ 7.88 8.38 1.02 ---
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MC10H186
PACKAGE DIMENSIONS
CDIP-16 L SUFFIX CERAMIC DIP PACKAGE CASE 620A-01 ISSUE O
A
16 9
B
A
M L
B
1 8
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. 5 THIS DRAWING REPLACES OBSOLETE CASE OUTLINE 620-10. DIM A B C D E F G H K L M N INCHES MIN MAX 0.750 0.785 0.240 0.295 --- 0.200 0.015 0.020 0.050 BSC 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 0_ 15 _ 0.020 0.040 MILLIMETERS MIN MAX 19.05 19.93 6.10 7.49 --- 5.08 0.39 0.50 1.27 BSC 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 0_ 15 _ 0.51 1.01
16X
J
E F C K T N G
16X
0.25 (0.010)
M
TB
SEATING PLANE
D
0.25 (0.010)
M
TA
-A-
16 9
B
1 8
PDIP-16 P SUFFIX PLASTIC DIP PACKAGE CASE 648-08 ISSUE R
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01
F S
C
L
-T- H K G D
16 PL
SEATING PLANE
J TA
M
M
0.25 (0.010)
M
MECL 10H and MECL 10K are trademarks of Motorola, Inc.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: N. American Technical Support: 800-282-9855 Toll Free Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 61312, Phoenix, Arizona 85082-1312 USA Phone: 480-829-7710 or 800-344-3860 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Fax: 480-829-7709 or 800-344-3867 Toll Free USA/Canada Phone: 81-3-5773-3850 Email: orderlit@onsemi.com ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative.
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MC10H186/D

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